Από το site της ASUS:
The problem with fast, ultra-thin laptops boils down to basic physics. To prevent the laptop enclosure itself getting hot, warm air inside needs to be expelled as quickly as possible to the outside world. With ZenBook 3’s mighty Intel® Core™ i7 processor inside, our engineers had to invent a brand-new cooling system using state-of-the-art components such as a liquid-crystal-polymer fan impeller that’s just 0.3mm thick and a copper-alloy heat pipe with walls a mere 0.1mm thick. This innovative cooling system is a mere 3mm thick, and the warm air is gently routed through hidden vents in the hinge for efficient, serenely quiet cooling even under full load.